Integrated Substrate for Anti-Shake Apparatus

ABSTRACT

An integrated substrate for an anti-shake apparatus defined with an optical axis includes: a substrate, a lens module, an anti-shake apparatus and an image-sensing module. The substrate includes a frame having, a predetermined thickness. The frame includes a first surface, a second surface, a first circuit layout, and a second circuit layout. The lens module is located above the substrate on the optical axis. The anti-shake apparatus is furnished between the lens module and the substrate. The image-sensing module has an active side and an inactive side, and the inactive side is furnished onto the second surface. The active side is located on the optical axis in a manner of facing the lens module. The anti-shake apparatus is coupled to the first circuit layout, while the image-sensing module is coupled to the second circuit layout. The first and second circuit layouts comprise a plurality of first and second metal leads, respectively.

This application claims the benefit of Taiwan Patent Application SerialNo. 101136402, filed Oct. 2, 2012, the subject matter of which isincorporated herein by reference.

BACKGROUND OF INVENTION 1. Field of the Invention

The invention relates to an integrated substrate structure foranti-shake apparatuses, and more particularly to the substrate structurethat can integrate an image-sensing, module and an anti-shake apparatusinto a single piece, in which the substrate provides two differentcircuit layouts to energize individually the image-sensing module andthe anti-shake apparatus; such that the manufacturing cost can bereduced by using less elements, the production yield can be promoted,and the miniaturization in products can be made possible,

2. Description of the Prior Art

As the technology prospers, more and more versatile electronic productsfor information can be seen in the marketplace. One of significanttrends for mainstream electronic products is provide a product that isminiaturized in volume but able to provide various entertainmentpurposes, more human amicable, and better to meet consumers' fashionneeds. For example, in mobile phones, the product that can integrate adigital camera device, a notebook computer or a MP3, or can forms as aPAD having a digital-camera function is one of the hot topics in thisindustry. Apparently, common features for almost all these improvementsare to achieve goals in minimization, easy-assembling, and simplifiedmanufacturing processes.

Referring now to FIG. 1, a conventional anti-shake image-sensingstructure 1 is shown in a cross-sectional view to have an image-sensingmodule 11, a substrate 12, a carrier base 13, 1 lens module 14, ananti-shake mechanism 15, a circuit board and a plurality of metal wires17, in which the image-sensing module 11 is located on the substrate 12and is electrically connected via the metal wires 17, and the carrierbase 13 is to house thereupon so as to protect the electric connectionby the metal wires 17 between the image-sensing module 11 and thesubstrate 12. The anti-shake mechanism 15 is located on the circuitboard 16 and under the lens module 14, in which the circuit board ismounted on the carrier base 13. The lens module 14 is fixed to thecircuit board 16 via the anti-shake mechanism 15. The circuit board 16further has a central hole 161 located corresponding thereupon to thecentral portion of the lens module 14 and thereunder a penetration hole131 of the carrier base 13 above the image-sensing module 11. Upon suchan arrangement, the optical path for capturing the image of a foreignobject from a chip on the image-sensing module 11 to the foreign objectoutside the lens module 14 is to go through the penetration hole 131 ofthe carrier base 13, the central hole 161 of the circuit board 16, alens unit 141 preset in the central of the lens module 14.

However, in the conventional anti-shake image-sensing structure 1described above, the image-sensing module 11 and the anti-shakemechanism 15 are located separately to the substrate 12 and the circuitboard 16. The circuit board 16 is further mounted to the insulatedcarrier base 13 so as to top on the image-sensing module 11 and therebyto relate the lens module 14 and the image-sensing module 11. Upon suchan arrangement, the minimization for this conventional structure 1 ishard to achieve for a high possibility of a tilt spacing exists betweenthe image-sensing module 11 and the circuit board 16, which would leadto a bias in the image optical paths and make cumbersome in assemblingthe structure 1.

SUMMARY OF THE INVENTION

Accordingly, it is the primary object of the present invention toprovide an integrated substrate for an anti-shake apparatus, in whichtwo different circuit layouts are provided by the same substrate torespectively energize an image-sensing module and an anti-shakeapparatus, such that advantages in less elements, less assemblytolerance and a minimized size in thickness can be obtained.

In the present invention, the integrated substrate for an anti-shakeapparatus defined with an image-capturing optical axis includes asubstrate, a lens module, an anti-shake apparatus and an image-sensingmodule. The substrate further includes a frame with a predeterminedthickness, in which the frame has a first surface, a second surface, afirst circuit layout and a second circuit layout. The first circuitlayout and the second circuit layout are formed by a plurality of firstmetal leads and a plurality of second metal leads, respectively.

The lens module is located on the image-capturing axis above thesubstrate. The anti-shake apparatus is located between the lens moduleand the substrate. The lens module is suspended above the substrate bythe anti-shake apparatus. The image-sensing module further has an activeside and an inactive side, in which the inactive side is located on thesubstrate while the active side is located on the optical axis at aposition corresponding to the lens module. The anti-shake apparatus iselectrically connected with the substrate through the first circuitlayout, while the image-sensing module is electrically connected withthe substrate through the second circuit layout.

All these objects are achieved by the integrated substrate for ananti-shake apparatus described below.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will now be specified with reference to itspreferred embodiment illustrated in the drawings, in which:

FIG. 1 is a schematic cross-sectional view of a conventional anti-shakeimage-sensing structure in the art;

FIG. 2 is a schematic exposed view of a first embodiment of theintegrated substrate for an anti-shake apparatus in accordance with thepresent invention;

FIG. 3 is a perspective view of FIG. 2;

FIG. 4 is a cross-sectional view of FIG. 3;

FIG. 5 is a schematic cross-sectional view of a second embodiment of theintegrated substrate for an anti-shake apparatus in accordance with thepresent invention;

FIG. 6 is a perspective view of FIG. 5;

FIG. 7 is a schematic cross-sectional view of a third embodiment of theintegrated substrate for an anti-shake apparatus in accordance with thepresent invention;

FIG. 8 is a schematic cross-sectional view of a fourth embodiment of theintegrated substrate for an anti-shake apparatus in accordance with thepresent invention; and

FIG. 9 is a top view of FIG. 8.

DESCRIPTION OF THE PREFERRED EMBODIMENT

The invention disclosed herein is directed to an integrated substratefor an anti-shake apparatus. In the following description, numerousdetails are set forth in order to provide a thorough understanding ofthe present invention. It will be appreciated by one skilled in the artthat variations of these specific details are possible while stillachieving the results of the present invention. In other instance,well-known components are not described in detail in order not tounnecessarily obscure the present invention.

Referring now to FIG. 2, FIG. 3 and FIG. 4, a first embodiment of theintegrated substrate for an anti-shake apparatus in accordance with thepresent invention is shown in an exploded view, an assembled perspectiveview and a cross-sectional view, respectively.

In this first embodiment, the integrated substrate 2 for an anti-shakeapparatus includes a substrate 21, a lens module 22, an anti-shakeapparatus 23 and an image-sensing module 24. The substrate 21 formed asa frame with a predetermined thickness further includes a first surface211, a second surface 212, a first circuit layout 213 and a secondcircuit layout 214. Preferably, the substrate 21 can be formed bylaminating a plurality of integrated circuit layers, in which each ofthe integrated circuit layers is furnished with a circuit layout. Amongthe integrated circuit layers, plural conductive pillars or vias can beapplied to establish electric inter-layer connection. Upon such anarrangement, the first circuit layout 213 on the first surface 211 andthe second circuit layout 214 on the second surface 212 can beelectrically coupled. The image-sensing module 24 further includes anactive side 241 and an inactive side 242. Between the lens module 22 andthe image-sensing module 24, an optical axis 4 is defined to demonstratethe optical path of imaging a foreign object on the image-sensing module24.

In this first embodiment, a penetration hole 210 for providing theoptical axis 4 to penetrate through the lens module 22 and theimage-sensing module 24 is located at the central portion of thesubstrate 21. On the second surface 212 of the substrate 21, aconcave-down step structure 215 is formed in the middle portion of thesecond surface 212. The first circuit layout 213 located on the firstsurface 211 of the substrate 21 is to facilitate electric communicationsamong multiple contact points on the anti-shake apparatus 23. The secondcircuit layout 214 located on the step structure 215 of the secondsurface 212 of the substrate 21 is to facilitate electric communicationsamong another multiple contact points on the image-sensing module 24. Inthe present invention, the substrate 21 can be one of the glasssubstrate, a ceramic substrate and a printed circuit board.

In this embodiment, the first circuit layout 213 and the second circuitlayout 214 include a plurality of first metal leads 2131 and a pluralityof second metal leads 2141, respectively. Each of the first and thesecond metal leads 2131, 2141 is formed as a planar strip preferablycarved into the respective surface in a radial out-extending and evendistributed manner on the corresponding first or second surface 211,212. In particular, the first metal lead 2131 is extended from thelateral side of the substrate 21 to carve at the first surface 211 (thetop surface) of the substrate 21, in which the end thereof on the firstsurface 211 is there for electric connection with respective contactpoint on the anti-shake apparatus, while another end of the first metallead 2131 is located at the lateral side of the substrate 21 forelectric connection with a control circuitry that is pre-determined tocontrol the anti-shake apparatus 23.

In addition, the second metal lead 2141 of the second circuit layout 214is extended from the second surface 212 to the inside of the stepstructure 215 of the second surface 212. One end of the second metallead 2141 is carved into the step structure 215 for establishingelectric connection with the image-sensing module 24 (or the imagesensor chip), while another end thereof is located on the second surface212 as a contact point for another electric connection with otherelectronic or electric elements. In the present invention, the metallead, either the first metal lead 2131 or the second metal lead 2141,can be produced from a stamping process or an etching process upon ametal sheet, and the metal material can be one of the copper, aluminum,alloy, and any appropriate metal material.

In the present invention, the substrate 21 can further includethereinside a passive element, a drive IC and a circuit for driving agyroscope, in which all the aforesaid elements inside the substrate 21can establish electric connections with foreign devices via the firstand/or the second circuit layouts 213, 214. Particularly, the preferredpositions for the output terminals of the substrate 21 are at theextension ends of the first and the second metal leads 2131, 2141 of thecorresponding first and the corresponding second circuit layouts 213,214, in which the extension ends are located at the lateral side (in thethickness direction) and/or the second surface 212 (the bottom side) ofthe substrate 21. Similarly, the circuitries inside the substrate 21(including the passive element, the drive IC and the circuit for drivinga gyroscope) can also utilize the aforesaid extension ends to be thecontact points for electrically outputting. For example, in the casethat the electric output terminals for the substrate 21 are mainlychosen to be at the second surface 212 (the bottom surface) of thesubstrate 21, the first metal lead 2131 can be further extended from thelateral side to the to second surface 212 of the substrate 21, the sameas which the second metal lead 2141 locates. Upon such an arrangement,the second surface 212 can provide simultaneously output terminals ofthe first circuit layout 213 and the second circuit layout 214 forexternal electrical contact purposes.

In the present invention, the lens module 22 can include a plurality oflenses (either zooming lenses or focus lenses, or both). In thisembodiment, the lens module 22 is preferred to be a zooming lens moduleor a focus lens module which is driven by an electromagnetic drivedevice formed by coils and magnets. As shown in this embodiment, thelens module 22 further includes a casing 221, a base frame 222, acarrier 223, a lens 224 and an electromagnetic drive module 225. Thelens 224 is mounted in a central portion of the carrier 223, and thusdisplaces synchronically with the carrier 223. The carrier 223 locatedin an accommodation space 2221 inside the base frame 222. A guidemechanism 2222 also inside the base frame 222 is introduced to regulatethe carrier 223 to precede an axial motion along the image-capturingoptical axis 4 inside the accommodation space 2221. In anotherembodiment as shown in FIG. 5, the guide mechanism 2222 can be a drivemotor of spring plate type, which the spring plates are electricallyconnected to the first circuit layout 213 or the second circuit layout214 of the substrate 21 via the spring member 233.

The electromagnetic drive module 225 further includes a magnetic member2251, a coil 2252 and a circuit board 2253. The magnetic member 2251 islocated at the carrier 223 at a position corresponding to the coil 2252located at the base frame 222. The circuit board 2253 is attachedexteriorly to the base frame 222, and also between the casing 221 andthe base frame 222. The circuit board 2253 is connected electrically tothe first circuit layout 213 or the second circuit layout 214 of thesubstrate 21 via the spring member 233.

Preferably, the embodiment shall have two pairs of the magnetic members2251 and the corresponding coils 2252. The magnetic member 2251 can be apermanent magnet. In operations, the circuit board 2253 applies specificcurrents to the coil 2252 so as to form a corresponding magnetic fieldwith a desired direction. The magnetic member 2251 is then moved by themagnetic field so as to drive synchronically the carrier 223 along theimage-capturing optical axis 4 inside the accommodation space 2221. Asthe direction of the applied currents changes, the direction of theinduced magnetic field is also reversed. Upon such an arrangement,accounting to the changes in applied currents to the coils 2252, thecarrier 223 as well as the lens 224 can be moved back and forth insidethe accommodation space 2221 so as to serve a corresponding zooming orfocusing order.

The image-sensing module used to capture foreign images can be a devicehaving a charge coupled device (CCD) or a complementary metal oxidesemiconductor (CMOS). By providing the lens module 22 to transfer, alongthe image-capturing optical axis 4, an image of a foreign object to forma corresponding photo image on the imaging unit (CCD or CMOS) of theimage-sensing module 24, the photo image is then transformed into acorresponding digital photo image data readable to a computer, a digitalcamera or a digital recorder, by the image-sensing module 24. However,techniques for the lens module 22 and the image-sensing module 24 arealready matured in the art, and thus details thereabout are omittedherein.

In the present embodiment, the anti-shake apparatus 23 of the presentinvention is located in a center portion between the lens module 22 andthe substrate 21. Thereby, the lens module 22 can suspend over thecorresponding image-sensing module 24 via the anti-shake apparatus 23.With the anti-shake apparatus 23 to suspend the lens module 22 over theimage-sensing module 24 along the image-capturing optical axis 4, thelens module 22 can be quickly shifted back to a preferable position onthe image-capturing optical axis 4 by having the anti-shake apparatus 23to compensate the biased displacement, while meeting a foreign orunexpected forcing to stray off the image-capturing optical axis 4.

The anti-shake apparatus 23 includes at least one piezoelectric member231, 231′, a friction plate 232, a plurality of spring members 233 andat least one position-detecting module 234, 234′. A first axialdirection 81 and a second axial direction 82 perpendicular to the firstaxial direction are defined on the first surface 211 of the substrate21; i.e. the surface perpendicular to the image-capturing optical axis4. Two pairs of the piezoelectric members 231, 231′ are set on the firstsurface 211 of the substrate 21 by aligning individually with the firstaxial direction 81 and the second axial direction 82. The piezoelectricmembers 231, 231′ are both connected electrically to the first metallead 2131 of the first circuit layout 213 via appropriateelectric-conductive materials 6. Namely, the two pairs of thepiezoelectric members 231, 231′ form a planar 90-degree arrangement onthe substrate 21, and further top surfaces of the two pairs of thepiezoelectric members 231, 231′ are depressed onto the friction plate232, in which the friction plate 232 is located on a bottom surface 2201of the lens module 22. Upon such an arrangement, via the friction plate232, the two pairs of the piezoelectric members 231, 231′ can then drivethe lens module 22 to displace along the first axial direction 81 andthe second axial direction 82. In the present invention, the electricconductive material 6 can be any one of conductive glue, a solder, awielding pad and a solder ball.

In the present invention, the first axial direction 81 and the secondaxial direction 82 stand respectively for the X-axis and the Y-axis of a3D orthogonal coordinate system to span, as a Z=0 plane, the firstsurface 211 of the substrate 21. Obviously, the image-capturing opticalaxis 4, perpendicular to both the first axial direction 81 and thesecond axial direction 82 are the Z-axis of the same coordinate system.In the embodiment of the present invention, the two pairs of thepiezoelectric members 231, 231′ for compensating the displacement biasesof the lens module 22, with respect to the substrate 21, at the firstaxial direction 81 and the second axial direction 82 can be embodied aspiezoelectric motors with a preferred working frequency of 120 KHz orany if better.

In the present embodiment, when the piezoelectric member 231 is appliedby a voltage, the corresponding piezoelectric motor would drive the lensmodule 22 to move linearly along the first axial direction 81(X-direction). Similarly, when the piezoelectric member 231′ is appliedby another voltage, the corresponding piezoelectric motor would drivethe lens module 22 to move linearly along the second axial direction 82(Y-direction). Thus, the lens module 22 can be arbitrarily adjusted onthe surface spanned by the X-axis and the Y-axis and perpendicular tothe image-capturing optical axis 4 (Z-axis).

As shown, two position-detecting modules 234, 234′ are providedindividually to respective predetermined positions at two lateral sidesof the first surface 211 of the substrate 21. In the present invention,the position-detecting module 234, 234′ can be a magneto-resistivesensor such as a Hall effect sensor. The position-detecting modules 234,234′ are connected to the first metal leads 2131 of the first circuitlayout 213 via the electric conductive materials 6. Theposition-detecting modules 234, 234′ can compute the displacement biasesof the lens module 22 away from the image-capturing optical axis 4; i.e.the distances from zeros of the X-axis (along the first axial direction81) and the Y-axis (along the second axial direction 82). Thedisplacement biases are then compensated by actuating relevantly thepiezoelectric members 231, 231′ who push the lens module 22 via thefriction plate 232, so as to adjust the connection line of the lensmodule 22 and the image-sensing module 24 to coincide with theimage-capturing optical axis 4.

The friction plate 232 is mounted to the bottom surface 2201 of the lensmodule 22 at a position respective to the first surface 211 of thesubstrate 21, and the friction plate 232 is sit onto the piezoelectricmembers 231, 231′ so as to enhance the friction between the lens module22 and the piezoelectric members 231, 231′. A penetration hole 2321 forallowing the image-capturing optical axis 4 to pass is located at thecentral portion of the friction plate 232.

In this embodiment, each of the spring members 233 is formed as aslender sinusoidal winding metal plate, or a lengthwise spiral metalspring. Four sets of the spring members 233 are furnished to fourequal-spaced corners of lateral sides of the substrate 21. By having oneend of each the spring member 233 to be fixed to the substrate 21 whileanother end thereof to be fixed to the lens module 22, the lens module22 can be then suspended in a spring manner over the first surface 211of the substrate 21. Namely, by providing a plurality of the springmembers 233 to surround and fix the substrate 21 and also by having thelens module 22 to be elastically fixed over the substrate 21 in aparallel manner (i.e. perpendicular to the image-capturing optical axis4), the lens module 22 can then hold (without dropping off in anydirection) the connection with the substrate 21 upon meeting anunexpected impact or shake, and also a preset pulling force can existbetween the lens module 22 and the substrate 21. Thereby, the pullingforce can keep all-time contact between the friction plate 232 under thelens module 22 and the piezoelectric members 231, 231′ on the substrate21, such that a substantial friction forcing can be always there inbetween to make possible the piezoelectric members 231, 231′horizontally moving the lens module 22.

In the first embodiment of the present invention, the active side 241 ofthe image-sensing module 24 can be produced onto the concave stepstructure 215 of the second surface 212 of the substrate 21 by aflip-chip technique, and also the flip-chipping can overlap thepenetration hole 210. Upon such an arrangement, the active side 241 ofthe image-sensing module 24 can be in a position respective to the lensmodule 22 on the image-capture photo axis 4. Also, a plurality ofconductive ends 2411 at the outer rim of the active side 241 areelectrically coupled with the second circuit layout 214 at the concavestep structure 215.

Namely, while the elevation difference at the concave step structure 215exists over to the second surface 212, applying the flip-chip techniqueon the second surface 212 can embed the active side 241 of theimage-sensing chip 24 onto the step structure 215, and can also connectelectrically the conductive ends 2411 surrounding the active side 241 ofthe image-sensing chip 24 to the second metal leads 2141 of the secondcircuit layout 214 on the step structure 215 via the conductivematerials 6; such that risk of bridging shortcuts can be reduced.

In following descriptions upon some more embodiments in accordance withthe present invention, for most of the elements in these embodiments areresembled to or at least similar to the corresponding elements in theaforesaid embodiment, details for the same elements and the samestructures are omitted herein. Further, any element in any followingembodiment would be given the same name and number as the element in theaforesaid embodiment if their structures and serving purposes are thesame. Any element in any following embodiment would be given the samename but a number with a tailing letter as the similar element in theaforesaid embodiment if their structures and serving purposes aresimilar.

Referring now to FIG. 5 and FIG. 6, a cross-sectional view and aperspective view of a second embodiment of the integrated substrate foran anti-shake apparatus in accordance with the present invention isshown, respectively. Compared to the embodiment shown in FIG. 2, themajor difference between this second embodiment and the previous firstembodiment is that the integrated substrate 2 a of this embodimentincludes an interior groove 216 is formed in the central empty of thesubstrate 21 a; i.e. at the midway between the first surface 211 a andthe second surface 212 a. The first circuit layout 213 a is extendedfrom the first surface 211 a to the lateral surface of the substrate 21a. In the lateral surface, the first circuit layout 213 a protrudes aplurality of the first metal leads 2131 a for electrically connection tothe contact points on the piezoelectric member 231, 231′.

One ends of the second metal leads 2141 a of the second circuit layout214 a are extended to a groove bottom surface 2161 a of the interiorgroove 216 of the substrate 21 a, while another ends of the second metalleads 2141 a are extending through a groove vertical wall 2162 a and thefirst surface 211 a and are finally bent to be embedded on the lateralsurface of the substrate 21 a. The inactive side 242 a of theimage-sensing module 24 a is attached to be mounted on the groove bottomsurface 2161 a of the interior groove 216 a at a specific region that todoes not appear any portion of the second circuit layout 214 a. On theother hand, the active side 241 a of the image-sensing module 24 a facesupward to the lens module 22 on the image-capturing optical axis 4.Plural conductive ends 2411 a on the active side 241 a of theimage-sensing module 24 a are electrically bridged individually bycorresponding metal wires 5 to the respective second metal leads 2141 aembedded on the groove bottom surface 2161 a.

As shown in FIG. 6, the first metal leads 2131 a of the first circuitlayout 213 a on the substrate 21 a and the second metal leads 2141 a ofthe second circuit layout 214 a inside the interior groove 216 a arearranged in an alternative manner around the interior groove 216 a andalong the first and the second axial directions 81, 82 on the firstsurface 211 a (i.e. the X-Y plane). Upon such an arrangement, upwardextension of the second metal lead 2141 a inside the interior groove 216a to the first surface 211 a won't interfere or intersect any of thefirst metal leads 2131 a embedded on the first surface 211 a. Namely, oneither the first surface 211 a or the lateral surface of the substrate21 a, the first metal leads 2131 a standing for the first circuit layout213 a and the second metal leads 2141 a standing for the second circuitlayout 214 a can be alternatively arranged and embedded around theinterior groove 216 a so as to provide multiple contact points toelectrically couple the foreign electronic or electric devices.

Referring now to FIG. 7, a cross-sectional view of the third embodimentof the integrated substrate for an anti-shake apparatus in accordancewith the present invention is shown. The major difference between thisthird embodiment and the second embodiment of FIG. 5 is that theinactive side 242 b of the image-sensing module 24 b is attached to bemounted above the groove bottom surface 2161 a of the interior groove216 a at a region that does appear portion of the second circuit layout214 a. On the other hand, the active side 241 b of the image-sensingmodule 24 b faces upward to the lens module 22 at the image-capturingoptical axis 4.

Namely, plural contact points 2421 b can be provided to the inactiveside 242 b of the image-sensing module 24 b so as to connectelectrically to the respective second metal leads 2141 a of the secondcircuit layout 214 a embedded on the groove bottom surface 2161 a of theinterior groove 216 a via the appropriate conductive materials 6 (suchas conductive glue, solders or solder balls). Upon such an arrangement,the image-sensing module 24 b inside the interior groove 216 can obtaincontrols transmitted from the second metal leads 2141 a so as to havethe lens module 22 to perform image-capturing upon a foreign object.

Referring now to FIG. 8 and FIG. 9, a cross-sectional view and a topview of the same fourth embodiment of the integrated substrate for ananti-shake apparatus in accordance with the present invention are shown,respectively. The major difference between this fourth embodiment andthe second embodiment of FIG. 5 is that the anti-shake apparatus 23 a ofthe integrated substrate 2 c of this fourth embodiment can furtherincludes at least two coils 235 a, 235 a′, at least two magnets 236 a,236 a″ and a plurality of hanging wires 237. In the fourth embodiment,the hanging wires 237 are fixed to four lateral sides of the substrate21 a in a manner of parallel to the image-capturing optical axis 4 tosuspend the lens module 22 above the substrate 21 a. In the presentinvention, these hanging wires 237 are solid and straightly extended.The two coils 235 a, 235 a′ separately mounted on the first surface 211a of the substrate 21 a are connected electrically to the first metalleads 2131 a of the first circuit layout 213 a on the first surface 211a via the conductive materials 6 (conductive glue, solders or solderballs).

The two magnets 236 a, 236 a′ are separately mounted on a bottom surface2201 of the lens module 22 at positions corresponding to the respectivecoils 235 a, 235 a′. The two pairs of the coils 235 a, 235 a′ and themagnets 236 a, 236 a′ are to lie along the first axial direction 81 andthe second axial direction 82, respectively. By providing differentdirections of the input currents to the coils 235 a. 235 a′, thedirection of the magnetic lines induced by the coils 235 a, 235 a′ canalso vary so as thereby to drive the lens module 22 having the magnets236 a, 236 a′ to move along the image-capturing optical axis 4 and thusto perform correction movements against the existing displacement biasesof the lens module 22 with respect to the substrate 21 a. As shown, theposition-detecting modules 234 a, 234 a′ are mounted to the respectivepredetermined positions on the first surface 211 a of the substrate 21 aand aside to the corresponding coils 235 a, 235 a′. Theposition-detecting modules 234 a, 234 a′ are electrically connected tothe first metal leads 2131 a of the first circuit layout 213 a via theconductive materials 6. By providing the position-detecting modules 234a, 234 a′, the displacement biases of the lens module 22 away from theimage-capturing optical axis 4 in the first axial direction 81 and thesecond axial direction 82 can then be computed. Namely, through thedirection changes of the input currents from the first metal lead 2131a, the magnetic lines induced by the coils 235 a, 235 a′ would alteraccordingly, and thus the lens module 22 having the magnets 236 a, 236a′ can then be move to compensate the displacement biases of the lensmodule 22 away from the image-capturing optical axis 4.

In summary, the integrated substrate 2 for an anti-shake apparatus inaccordance with the present invention defined with an image-capturingoptical axis 4 includes a substrate 21, a lens module 22, an anti-shakeapparatus 23 and an image-sensing module 24. The substrate 21 furtherincludes a frame with a predetermined thickness, in which the frame hasa first surface 211, a second surface 212, a first circuit layout 213and a second circuit layout 214. The first circuit layout 213 and thesecond circuit layout 214 further include a plurality of first metalleads 2131 and a plurality of second metal leads 2141, respectively.

The lens module 22 is located on the image-capturing axis 4 above thesubstrate 21. The anti-shake apparatus 23 is located between the lensmodule 22 and the substrate 21. The lens module 22 is suspended abovethe substrate 21 as well as the image-sensing module 24 by theanti-shake apparatus 23. The image-sensing module 24 further has anactive side 241 and an inactive side 242, in which the inactive side 242is located on the substrate 21 while the active side 241 is located onthe optical axis 4 at a position facing the lens module 22. Theanti-shake apparatus 23 is electrically connected with the substrate 21through the first circuit layout 213, while the image-sensing module 24is electrically connected with the substrate 21 through the secondcircuit layout 214.

By providing the first circuit layout 213 and the second circuit layout214 to the first surface 211 and the second surface 212 of the substrate21, respectively, so as to electrically connect with the anti-shakeapparatus 23 and the image-sensing module 24, the components needed forthe system can be reduced and also the manufacturing cost can be trimmeddown. Further, possible manufacturing tolerance to bias the photo axis 4by accumulated components' tolerances can be avoided. Thereby, yield andprecision of the production can be substantially increased, and anoverall miniaturization upon the integrated substrate 2 for ananti-shake apparatus can thus be successfully obtained.

While the present invention has been particularly shown and describedwith reference to a preferred embodiment, it will be understood by thoseskilled in the art that various changes in form and detail may bewithout departing from the spirit and scope of the present invention.

1-11. (canceled)
 12. An integrated substrate, comprising: a substrate; alens module, suspended above the substrate and movable relative to thesubstrate; said lens module having a bottom surface; at least onemagnet, mounted on the lens module and movable together with the lensmodule relative to the substrate; at least one coil, connected to thesubstrate and cannot be moved relative to the substrate; and at leastone position-detecting module, for detecting displacements of the lensmodule relative to the substrate; said position-detecting module beingconnected to the substrate and cannot be moved relative to thesubstrate.
 13. The integrated substrate according to claim 12, whereinsaid at least one magnet and said at least one coil are components of ananti-shake apparatus; said anti-shake apparatus further comprises aplurality of hanging wires fixed to four lateral sides of the substratein order to suspend the lens module above the substrate.
 14. Theintegrated substrate according to claim 12, wherein said lens modulecomprises: a base frame; a carrier, located inside said base frame in amovable manner; a lens, mounted in the carrier and defining an opticalaxis; and an electromagnetic drive module, located between the baseframe and the carrier in such a manner that, the electromagnetic drivemodule being capable of driving the carrier together with the lens tomove relative to the base frame along said optical axis; wherein, thebottom surface faces toward the substrate and the position-detectingmodule, in addition, the bottom surface is at least partly locatedbetween the carrier and the substrate.
 15. The integrated substrateaccording to claim 14, wherein said lens module further comprises acasing for receiving the base frame; said base frame has anaccommodation space for receiving the carrier in such a manner that, thecarrier together with the lens are moveable along the optical axisinside the accommodation space.
 16. The integrated substrate accordingto claim 12, wherein the position-detecting module is located betweenthe bottom surface and the substrate.
 17. The integrated substrateaccording to claim 12, wherein the substrate is furnished with a firstcircuit layout, said at least one coil and said at least oneposition-detecting module are electrically connected with the firstcircuit layout.
 18. The integrated substrate according to claim 17,wherein the substrate is further furnished with a second circuit layout;the substrate is able to be attached with an image-sensing module whichis electrically connected with the second circuit layout.
 19. Theintegrated substrate according to claim 18, wherein theposition-detecting module is located between the bottom surface and theimage-sensing module.
 20. The integrated substrate according to claim18, wherein the position-detecting module is attached to the substrateand is located between the bottom surface and the second circuit layout.21. The integrated substrate according to claim 18, wherein, thesubstrate has a first surface and a second surface which is differentfrom the first surface; the position-detecting module and the firstcircuit layout are located at least on the first surface; theimage-sensing module and the second circuit layout are located at leaston the second surface.
 22. The integrated substrate according to claim18, wherein, said image-sensing module has an active side and aninactive side opposite to said active side; the image-sensing module islocated on the substrate and the active side is located at a positionfacing the lens module.
 23. The integrated substrate according to claim22, wherein the substrate has a first surface and a second surfaceopposite to said first surface; a penetration hole is located at acentral portion of the substrate, a concave-down step structure isformed in a middle portion of the second surface, the first circuitlayout is connected with both the position-detecting module and the atleast one coil; wherein the position-detecting module and the at leastone coil are directly attached on the first surface of the substrate,while the image-sensing module is directly attached on the concave-downstep structure of the second surface of the substrate.
 24. Theintegrated substrate according to claim 23, wherein the first circuitlayout is located on the first surface of the substrate, and the secondcircuit layout is located on the step structure of the second surface ofthe substrate to facilitate electric connections with the image-sensingmodule.
 25. The integrated substrate according to claim 23, wherein theactive side of the image-sensing module is mounted onto the concave-downstep structure and the penetration hole of the second surface by aflip-chip technique, the active side of the image-sensing module is in aposition respective to the lens module, a plurality of conductive endsat an outer rim of the active side are electrically coupled with thesecond circuit layout exposed on the concave-down step structure viaconductive materials, and the conductive material is one of conductiveglue, a solder and a solder ball.
 26. The integrated substrate accordingto claim 22, wherein the substrate has a first surface and a secondsurface opposite to said first surface; an interior groove is formed ina central empty portion of the substrate; the first circuit layout isconnected with both the position-detecting module and the coil; whereinthe position-detecting module and the coil are directly attached on thefirst surface of the substrate; wherein the inactive side of theimage-sensing module is attached to be mounted on a groove bottomsurface of the interior groove, the active side of the image-sensingmodule faces upward to the lens module, and the image-sensing module iselectrically connected to the second circuit layout embedded inside theinterior groove.
 27. The integrated substrate according to claim 26,wherein the first circuit layout is extended from the first surface to alateral surface of the substrate, and the second circuit layout insidethe interior groove of the substrate is extended to the first surfaceand the lateral surface of the substrate.
 28. The integrated substrateaccording to claim 27, wherein a plurality of conductive ends on theactive side of the image-sensing module are electrically bridgedindividually by corresponding metal wires respectively to a plurality ofsecond metal contacts of the second circuit layout embedded inside theinterior groove.
 29. The integrated substrate according to claim 27,wherein the inactive side of the image-sensing module is connectedelectrically to a plurality of second metal contacts of the secondcircuit layout embedded inside the interior groove via conductivematerials, and the conductive material is one of conductive glue, asolder, a solder pad and a solder ball.
 30. The integrated substrateaccording to claim 14, wherein, the electromagnetic drive modulecomprises a magnetic member, a coil member and a circuit board; themagnetic member is located at the carrier at a position corresponding tothe coil member located at the base frame; the circuit board is attachedto the base frame; the circuit board is connected electrically to thesubstrate via a plurality of spring members.